دانلود نرم افزار Agilent EMPro 2013.07

Agilent EMPro یکی دیگر از نرم افزار های شرکت Agilent برای آنالیز EM میباشد . در این نرم افزار میتوان تاثیر امواج الکترومغناطیسی RF و microwave را بر روی قطعات مختلف نظیر تراشه های high-speed ، بسته بندی مدارات مجتمع ( IC packages ) ،آنتن ، اتصال pcb های on-chip و off-chip و… تحلیل و شبیه سازی کرد .

برای کسب اطلاعات بیشتر در مورد این نرم افزار و دانلود اخرین ورژن آن ادامه مطلب را بخوانید .

قابلیت های اصلی نرم افزار :

یکپارچگی روند طراحی : یکپارچگی روند طراحی به کاربر اجازه می دهد تا قطعات سه بعدی ایجاد شده را به صورت دو بعدی و در محیط شماتیک نرم افزار Advanced Design System (ADS) توسط EM-circuit شبیه سازی نماید .
تکنولوژی شبیه سازی نوین : پیکربندی و اجرای شبیه سازی میتواند در دو حوزه ی فرکانس و زمان به صورت سه یعدی انجام شود ( با فناوری Finite Element Method (FEM) and Finite Difference Time Domain (FDTD) )
رابط کاربری کارآمد : رابط نرم افزاری کاربر پسند با ایجاد یک GUI قوی ، باعث میشود تا کاربر در کمترین زمان ممکن پروژه های خود را انجام دهند .

ویژگی ها :

محیط مدل سازی مدرن و کار آمد :
- اشیا سه بعدی مورد نظر میتوانند به صورت دستی و موقتی یا از طریق الگو های آماده ایجاد شوند
- فایل های cad میتوانند به داخل نرم افزار ایمپورت شده ، تغییر کرده و شبیه سازی شوند
- اسکریپت پر قدرت Python امکانات پیشرفته ای را جهت اعمال خاص ایجاد کرده است .
- نرم افزار در محیط ویندوز و لینوکس میتواند اجرا شود
یکپارچگی با روند طراحی نرم افزار ADS :
- پارامتر ها و مشخصات قطعات سه بعدی میتواند به نرم افزار ADS صادر شده و در محیط شماتیک و layouts این نرم افزار شبیه سازی شود .
- Layout اشیا میتواند از نرم افزار ADS به این نرم افزار وارد شود .

شبیه سازی در حوزه فرکانس:
- موتور شبیه ساز Finite Element Method (FEM)
- بهترین نرم افزار برای شبیه سازی قطعات RF/microwave
- Direct and Iterative solvers for different applications
- Same FEM engine can be launched from both EMPro and ADS
شبیه سازی در حوزه زمان :
- موتور شبیه ساز Finite Difference Time Domain (FDTD)
- Best for electrically large problems, such as antea simulations and signal integrity applications
- Compliance Testing option available for regulatory analyses such as Specific Absorption Rate (SAR)
- Graphical Processor Unit (GPU) Acceleration option available for dramatic speed & capacity improvement

چه کسانی از EMPro استفاده میکنند :

EMPro Users
IC Package DesignersThe performance of an RFIC, monolithic microwave integrated circuits (MMIC), high-speed IC, or system-in-package (SIP) is directly impacted by the effects of packaging, including wire bonds and solder balls/bumps. Traditionally, designers had to draw and analyze packages in a separate, 3D EM tool and then laboriously import the results back to the IC or SIP circuit-design environment for a combined analysis. With EMPro, you can efficiently create 3D package structures that can be combined with 2D circuit layouts in Advanced Design System (ADS). This allows co-design of the IC, package, laminate, and module with circuit simulation and 3D EM simulation in a streamlined design flow. See our EM Applications Center.
Multilayer RF Module DesignersRF modules typically are constructed from multilayer ceramic or laminate dielectric material with embedded RF passive components between the layers. Such dielectric brick structures caot be accurately solved by planar EM simulators, which assume infinite dielectric layers and do not account for edge proximity fringing. The embedded RF components are drawn by RF circuit layout macros which would be very time consuming to reproduce in a standalone 3D EM tool. Full 3D EM simulation integrated within the circuit design flow is the ideal solution for these applications. See our EM Applications Center.
RF & Microwave Component DesignersRF board designs include 3D components and coectors that need to be characterized to high frequencies. Component and coector designs created in other CAD tools can be imported into EMPro, and then simulated using either FEM or FDTD simulation technology. High frequency components such as resonators are sensitive to interactions with the surrounding PC board traces and vias. Such 3D components can be created and simulated in EMPro and then combined with a board layout in ADS for complete 3D EM simulation using FEM technology. See our EM Applications Center.
Aerospace/Defense Industry EngineersFDTD simulation has extremely high capacity and can handle large problems found in typical Aerospace/Defense applications. For example, FDTD can be used to optimize antea placement in aircraft, or can be used to perform Radar Cross Section analysis. Antea designs can also be exported from EMPro to ADS in order to optimize matching circuitry design. In ADS, link budget analysis and other system simulations can be performed. FEM simulation technology in EMPro can be used to simulate RF components and IC packaging commonly found in Aerospace/Defense systems. See our EM Applications Center.
High-Speed Coector DesignersHigh-speed coector types such as SATA and HDMI now support Gbits/s data throughput. High frequency S-parameter models of coectors can be generated in EMPro and cross-verified with both the FEM and FDTD simulators to give designers twice the confidence in 3D EM simulation accuracy. The models can then be included in an ADS design kit that can be distributed and installed into ADS as a coector library for use in signal-integrity analysis and design of high-speed serial chaels. See our EM Applications Center.
Antea DesignersA critical design task in the development of cellular and networking products is maximizing antea performance while minimizing antea size. EMPro can simulate the antea in realistic surroundings, including the phone components, housing and even the human hand and head. Compliance testing can also be performed, such as specific absorption ratio (SAR) and hearing aid compatibility (HAC). See our EM Applications Center.